BERGQUIST® GAP PAD® TGP 2000
Tuntud kui Gap Pad® 2000S40
Omadused ja eelised
This silicone-based, highly conformable, reinforced gap-filling material is recommended for low-stress applications requiring a mid- to high thermally conductive interface material.
BERGQUIST® GAP PAD® TGP 2000 is highly conformable, so the pad can fill air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application and assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, @ 1kHz | 6.0 |
| Dielektriline läbilöögipinge | 5000.0 Vac |
| Mahu resistiivsus | 1×10 Ohm m |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm Shore 00 | 30.0 |
| Soojusjuhtivus | 2.0 W/mK |
| Soojusmahtuvus, ASTM E1269 | 0.6 J/g-K |
| Standardpaksus | 0.508 - 3.175 mm |
| Tihedus | 2.9 g/cm³ |
| Töötemperatuur | -60.0 - 200.0 °C |
| Värvus | Hall |
BERGQUIST® GAP PAD® TGP 2000
This silicone-based, highly conformable, reinforced gap-filling material is recommended for low-stress applications requiring a mid- to high thermally conductive interface material.