BERGQUIST® GAP PAD® TGP 2000
Connu sous le nom de Gap Pad® 2000S40
Caractéristiques et avantages
This silicone based, highly conformable, reinforced gap filling material is recommended for low-stress applications requiring a mid to high thermally conductive interface material.
BERGQUIST® GAP PAD® TGP 2000 is highly conformable, so the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Informations techniques
| Capacité thermique, ASTM E1269 | 0.6 J/g-K |
| Conductivité thermique | 2.0 W/mK |
| Constante diélectrique, @ 1kHz | 6.0 |
| Cote d'inflammabilité | V-0 |
| Couleur | Gris |
| Densité | 2.9 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac Shore 00 | 30.0 |
| Résistivité volume | 1×10 Ohm m |
| Température de service | -60.0 - 200.0 °C |
| Tension de rupture diélectrique | 5000.0 Vac |
| Épaisseur standard | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced gap filling material is recommended for low-stress applications requiring a mid to high thermally conductive interface material.