LOCTITE® ABLESTIK 2030SC
Features and Benefits
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A 1-part, flexible, hybrid-based die-attach adhesive designed for fast-curing, high-throughput component assemblies; suitable for a variety of package sizes.
For high-throughput die-attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid-technology adhesive is specially formulated to reduce stress and warpage, and is snap-curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
- Snap-curable for quick handling
- Low stress bonding
- 1-part: no mixing required
- Suitable for a variety of package sizes
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 29.0 ppm |
| Hot die shear strength | 0.96 kg-f |
| RT die shear strength, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Tensile modulus, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Thixotropic index | 4.6 |
LOCTITE® ABLESTIK 2030SC
A 1-part, flexible, hybrid-based die-attach adhesive designed for fast-curing, high-throughput component assemblies; suitable for a variety of package sizes.