LOCTITE® ABLESTIK 3290P
功能与优点
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach
LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290 adhesive.
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技术信息
| 固化方式 | 热固化 |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 68.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 101.0 ppm/°C |
| 玻璃化温度 (Tg) | 136.0 °C |
| 粘度，锥型和板型, @ 25.0 °C Speed 5 rpm | 12000.0 mPa.s (cP) |
| 触变指数 | 3.5 |
LOCTITE® ABLESTIK 3290P
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach