BERGQUIST® GAP FILLER TGF 3000SF
BERGQUIST® GAP FILLER TGF 3000SF is a 2-part, silicone-free gap filler for thermal management on high-throughput, silicone-sensitive assembly applications, such...
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BERGQUIST® GAP FILLER TGF 3000SF
BERGQUIST® GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler that is curable at room temperature and is suitable for use in high throughput assembly... -
BERGQUIST GAP PAD TGP 10000ULM
Your search “sil pads” was found in the TDS document related to this product
BERGQUIST GAP PAD TGP 10000ULM A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM). -
BERGQUIST® GAP FILLER TGF 2900LVO
Your search “sil pads” was found in the TDS document related to this product
Conversions (°C x 1.8) + 32 = °F kV/mm x 25.4 = V/mil mm / 25.4 = inches µm / 25.4 = mil N x 0.225 = lb N/mm x 5.71 = lb/in N/mm² x 145 = psi MPa x 145 = psi N·m x 8.851 = lb·in N·m x 0.738 = lb·ft N·mm x 0.142 = oz·in mPa·s = cP TDS... -
BERGQUIST® GAP FILLER TGF 4500CVO
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness... -
BERGQUIST® GAP FILLER TGF 4400LVO
Your search “sil pads” was found in the TDS document related to this product
Conversions (°C x 1.8) + 32 = °F kV/mm x 25.4 = V/mil mm / 25.4 = inches µm / 25.4 = mil N x 0.225 = lb N/mm x 5.71 = lb/in N/mm² x 145 = psi MPa x 145 = psi N·m x 8.851 = lb·in N·m x 0.738 = lb·ft N·mm x 0.142 = oz·in mPa·s =... -
BERGQUIST® GAP FILLER TGF 2200 APS
BERGQUIST® GAP FILLER TGF 2200 APS is a 2-part, thermally conductive, silicone-based liquid gap filler, which offers infinite thickness variations with little... -
LOCTITE® SI 5972 FC
LOCTITE® SI 5972 FC This alkoxy RTV-cure form-in-place gasket is easily dispensable for the next generation of automotive electronics assembly requirements. LOCTITE® SI 5972 FC is a fast-cure silicone liquid gasket with excellent adhesion... -
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
Your search “sil pads” was found in the TDS document related to this product
Due to this, many Henkel TIM materials indeed pass NASA outgassing standards and are listed on this specification. -
LOCTITE® ABLESTIK ICP 9000
Your search “sil pads” was found in the TDS document related to this product
LOCTITE® ABLESTIK ICP 9000 is an electrically conductive material that offers high adhesion and low stress for high end power IC packages including, SiC power devices as well as GaAs and GaN die transistors.
Showing 1 - 10 of 37 results