BERGQUIST® HI FLOW THF 1600P
Connu sous le nom de Hi-Flow® 300P
Caractéristiques et avantages
This high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement is designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.
BERGQUIST® HI FLOW THF 1600P is an electrically insulating, thermally conductive 55°C (131°F) phase reinforced change material with high temperature reliability (150°C / 302°F). Its polymide film provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The easy-release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.
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Informations techniques
| Conductivité thermique | 1.6 W/mK |
| Cote d'inflammabilité | V-0 |
| Couleur | Vert |
| Température de service | 150.0 °C |
| Type porteur | Polyimide |
| Épaisseur standard | 0.102 - 0.127 mm |
BERGQUIST® HI FLOW THF 1600P
This high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement is designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.