BERGQUIST® GAP PAD® TGP 5000
Conocido como Gap Pad® 5000S35
Características y Ventajas
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures.
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Información técnica
| Capacidad calorífica, ASTM E1269 | 1.0 J/g-K |
| Color | Verde claro |
| Conductividad térmica | 5.0 W/mK |
| Constante dieléctrica, @ 1kHz | 7.5 |
| Densidad | 3.6 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Goma a granel Shore 00 | 35.0 |
| Espesor | 0.508 - 3.175 mm |
| Resistencia a la flama | V-0 |
| Resistividad de volumen | 1×10 Ohm m |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
| Tensión de ruptura dieléctrica | 5000.0 Vac |
BERGQUIST® GAP PAD® TGP 5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.